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 0603 PACKAGE CHIP LED (0.6mm HEIGHT) TSP1-BF1608H6-L1M2Y
0603 Package Chip LED (0.6mm Height)
Features
* Package in 8mm tape on 7" diameter reel * Compatible with automatic placement equipment * Compatible with infrared and vapor phase reflow solder process * Mono-color type * RoHS Compliant
Applications
* * * * Backlighting in dashboard and switch Telecommunication: indicator and backlighting in telephone and fax Flat backlight for LCD, switch and symbol General use
QSLP1BF1
Descriptions
* The TSP1 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. * Besides, lightweight makes them ideal for miniature applications. etc.
Device Selection Guide
Chip Part No. TSP1-BF1608H6-L1M2Y Material InGaN Emitted Color Blue Lens Color Water Clear
TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com
Tel: (800)-247-2232 Fax: (800)-TAITFAX (800)-TAITRON (800)-824-8329 (661)-257-6060 (661)-257-6415
Rev. A/WW 2006-02-13 Page 1 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Absolute Maximum Ratings (Tamb=25C)
Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Soldering Temperature Electrostatic Discharge (HBM) Power Dissipation Peak Forward Current (Duty 1/10 @1KHz) Symbol Value 5 25 -40 ~ +85 -40 ~ +90 Reflow soldering: 260 (for 10 seconds) Hand soldering: 350 (for 3 seconds) 150 110 100 Unit V mA C C C V mW mA
VR IF Topr Tstg Tsol
ESD
Pd IFP
Electro-Optical Characteristics (Tamb=25C)
Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant wavelength Spectrum Radiation Bandwidth Forward Voltage Reverse Current Symbol Min. 11.5 --------465 ----2.5 ----Typ. ----120 468 ----25 --------Max. 28.5 --------475 ----3.1 50 Unit mcd deg nm Condition
IV
21/2 p d
IF =5mA
nm nm V A
VF IR
VR=5V
Notes: 1. Tolerance of Luminous Intensity is 10% 2. Tolerance of Dominant Wavelength is 1nm 3. Tolerance of Forward Voltage is 0.1V
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 2 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Typical Electro-Optical Characteristics Curves
Relative luminous intensity (%) Spectrum Distribution Forward Current IF(mA) Wavelength p(nm) Luminous Intensity vs. Ambient Temperature Relative luminous intensity (%) Forward Current vs. Forward Voltage
Forward Voltage (VF)-volts Luminous Intensity vs. Forward Current (Ta =25C) Relative luminous intensity (%)
Ambient Temperature Ta (C) Forward Current Derating Curve
Forward Current IF (mA)
Forward Current IF (A)
Ambient Temperature Ta (C)
Radiation Diagram
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 3 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below. Confidence level90% LTPD10%
No.
Items
Test Condition Temp.: 260C 5C Min. 5sec. H: +100C 15min 5 min L: -40C 15min H: +100C 5min 10 sec L: -10C 5min Temp.: 100C Temp.: -40C IF = 20 mA 85C / 85%RH
Test Hours / Cycles 6 Min.
Sample Size 22 PCS.
Ac/Re
1
Reflow Soldering
0/1
2
Temperature Cycle
300 Cycles
22 PCS.
0/1
3
Thermal Shock
300 Cycles
22 PCS.
0/1
4 5 6 7
High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity
1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs.
22 PCS. 22 PCS. 22 PCS. 22 PCS.
0/1 0/1 0/1 0/1
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 4 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Package Dimensions (In mm)
-
+
Note: The tolerances unless mentioned is 0.1mm
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 5 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Carrier Tape Dimensions:
Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is 0.1mm, Unit = mm
Reel Dimensions
Note: The tolerances unless mentioned is 0.1mm, Unit = mm
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 6 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Ordering Information TSP 1- B F 1608 H6 -L1M2 Y-92-TR71
Lead Free Tape & Reel 7=7 reel 1=3k per reel Factory Location Code Special Test Condition: IF=5mA See Code Table Height <=0.6mm Size in mm Flat Top Blue Convex Taitron SMD LED PCB Type
Code Range of Dominant Wavelength
Code X Y Min. 465.0 470.0 Max. 470.0 475.0 Unit nm Condition
IF=5mA
Code Range of Luminous Intensity
Code L1 L2 M1 M2 Min. 11.5 14.5 18.0 22.5 Max. 14.5 18.0 22.5 28.5 mcd Unit Condition
IF=5mA
Code Range of Forward Voltage
Code 9 10 11 Min. 2.5 2.7 2.9 Max. 2.7 2.9 3.1 V Unit Condition
IF=5mA
Notes: 1. Tolerance of Luminous Intensity is 10% 2. Tolerance of Dominant Wavelength is 1nm 3. Tolerance of Forward Voltage is 0.1V
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 7 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
Precautions for Use
1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 Do not open moisture proofs bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30C or less and 90% RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, The LEDs should be kept at 30C or less and 70% RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 605C for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.
4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 280C for 3 seconds within. Once in less than the soldering iron capacity 25W, leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 8 of 9
0603 Package Chip LED (0.6mm Height) TSP1-BF1608H6-L1M2Y
How to contact us:
US HEADQUARTERS
28040 WEST HARRISON PARKAWAY, VALENCIA, CA 91355-4162 Tel: (800) TAITRON (800) 247-2232 (661) 257-6060 Fax: (800) TAITFAX (800) 824-8329 (661) 257-6415 Email: taitron@taitroncomponents.com Http://www.taitroncomponents.com
TAITRON COMPONENTS MEXICO, S.A .DE C.V.
BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO C.P. 42970 MEXICO Tel: +52-55-5560-1519 Fax: +52-55-5560-2190
TAITRON COMPONETS INCORPORATED E REPRESENTACOES DO BRASIL LTDA
RUA DOMINGOS DE MORAIS, 2777, 2.ANDAR, SALA 24 SAUDE - SAO PAULO-SP 04035-001 BRAZIL Tel: +55-11-5574-7949 Fax: +55-11-5572-0052
TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE
CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, 200030, CHINA Tel: +86-21-5424-9942 Fax: +86-21-5424-9931
Rev. A/WW 2006-02-10 www.taitroncomponents.com Page 9 of 9


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